제이머티리얼즈

J Materials Co., Ltd

Product
Business Distributing the Materials of Semiconductors

Distributing the Materials of Semiconductors

  • POLY SILICON

  • Poly Silicon is a core base material located at the front of the PV Value Chain, which leads to solar power generation systems such as ingots, wafers, cells, and modules

  • INGOT

  • Silicon columns are made by rotating high-purity refined silicone solutions into castings.
    It can be obtained by using the silicon crystal growth technology such as the Chokralski method (CZ) or the floating zone method (FZ).

  • WAFER

  • Wafer is the basis for raising integrated circuits.
    Wafer is a single crystal column made by growing silicon (Si), mostly extracted from sand, sliced into a suitable thickness.

  • SLURRY

  • Improve cleaning properties and stand phenomena on wafer surfaces by adding anionic surfactant to improve dispersion.

Sililcon Materials

  • The usage of polysilicon

  • Polysilicon is the raw material of wafers, which is a main product of semiconductors, and the important basic material which is foremost of the main PV Value Chain of semiconductors for manufacturing wafers, such as the ingot and module for silicon parts.
    J materials Co., Ltd. distributes more than 10-Nine level ultrapure products (99.99999999% purity) that are needed in growing the ingot for semiconductor parts, and 11-Nine level (99.999999999% purity) polysilicon that is used in the semiconductor wafer.

  • The manufacturing
    process

  • We use metal silicon as the main material, which is made by returning SiO2 to carbon compounds, and reacting it with hydrogen and hydrochloric acid.
    By using the produced mixed silane, we make the ultrapure TCS through the distillation process.
    Also, we make ultrapure poly silicon by making it react in chemical evaporation at high temperatures.

    Semiconductor industry (Value Chain)

Appearance and Features

Property Specification
Appearance Qualified materials ㆍ Quality indicators of polysilicon blocks or bars consistent with contract terms
ㆍ The appearance and surface of the material are small and smooth
ㆍ May have cracks less than 3mm deep, but no interlayer
Coral materials ㆍ Blocks or bars of polysilicon, for facades and materials with small appearance, not smooth, or cracks with a surface greater than 3mm
ㆍ If the quality of these materials meets the contractual requirements, they are classified as Materials in any proportion
Wastes ㆍ Silicon particles and materials with graphite less than 3mm
Miscellanous items ㆍ Silicon material is not classified as Qualified Material, Coral Material, Waste

Bulk purity parameters

Item Donor
(ppta)
Acceptor
(ppta)
Carbon
(ppma)
Total Bulk Metal
(ppbw)
XHP ≤150 ≤50 ≤0.080 ≤1.000
XHG
XHS
XHN ≤300 ≤100 ≤0.100 ≤1.000

Surface metal(pptw)

Surfac
treatment
Na Al K Cr F Ni Cu Zn
AE ≤800 ≤500 ≤300 ≤80 ≤500 ≤80 ≤50 ≤200
CH ≤1000 ≤800 ≤400 ≤100 ≤1000 ≤200 ≤100 ≤500

Size

Size
number
1# 2# 3# 4# 5# ...
Size/mm 2-6 6-45 45-100 20-70 30-100

Sililcon Materials - Ingot

Product Name Silicon Crystal Silicon Ingot Multi-Crystal Silicon “Poly Ingot”
Application Si Electrode
Si Ring
Si Parts
Si Ring
Si Parts
Property Single Crystal Silicon Ingot Poly Ingot
Purity(%) 99.9999999%(11N) 99.9999999(9N)
Diameter Ø215~Ø600mm Customer Specification
Length ≤ 355mm
(≤0.02 ohm.cm)
G6: 998mm*998*300
Gr: 1170mm*1170*300
Direction <100>,<110>,<111> Columnar
Type P type, Boron Doped P type, Boron Doped
Resistance 0.001~1000 Ω~Cm 0.001~1000 Ω~Cm
Oxygen Content(ppma) ≤ 20 ppma ≤ 20 ppma
Carbon Content(ppma) ≤ 0.3 ppma ≤ 0.3 ppma

Design

Diameter Type/Orientation Resistivity(Ω·cm) Slip Length
200mm~300mm p<100>or as
customer
requried
<0.02
1-5
60-90
free 150mm~500mm
200mm~450mm p<100>or as
customer
requried
<0.02
1-5
60-90
free 150mm~400mm

Quality Management

Parameter Method Standard
Resistivity 4-Point Probe SEMI
Impurities GDMS IC-Grade
Oxygen/Carbon SIMS Per-Spec

Sales Wafer

  • The outline of Wafer

  • Semiconductor Integrated Circuit refers to the electronic component that integrates many elements in a chip.
    It is made to conduct and save various functions.
    In addition, wafer is the foundation for raising the integrated circuits.
    The wafer is mostly silicon extracted from sand, that is the original material in which the single crystal pillar that is made by growing the silicon is thinly sliced to a moderate thickness.

Purpose 12 INCH
12“
New
12“
Reclaim
12“
Reclaim
12“
New Bare
12“
New Bare
12“
New Oxide
Wafer
Thickness
775 +25, -35um 700~800um 750~800um 750~800um 730~800um 730~800um
Oxide
Thickness
1.0um±5% 1.0um±5% N/A N/A N/A N/A
Type P-type P-type P-type P-type P-type P-type
Notch/Flat Notch Notch Notch Notch Notch Notch
Purpose 8 INCH
8“
New Oxide
8“
Reclaim
8“
Reclaim
8“
New Bare
8“
New Oxide
8“
Reclaim
8“
Reclaim
8“
New Bare
8“
New Bare
Wafer
Thickness
725±25um 725±25um >600 725±25um 725±25um >700um >600um 725±25um 725±25um
Oxide
Thickness
1.0um 1.0um N/A N/A 1.0um 1.0um N/A N/A N/A
Type P-type P-type P-type P-type P-type P-type P-type P-type P-type
Notch/Flat Notch Notch Notch Notch Flat Flat Flat Flat Notch

Slurry

  • JMS-100BH Slurry

  • Improvement of Cleansing

    The colloidal silica maintains stability by resisting between (-)charges on the silica particle surface. M+ in the picture describes the metal-stabilized ion.
    The cleaning ability and the stain phenomenon on the wafer surface are improved with improving dispersibility by adding the anionic surfactant.

    pH stocking 방지 환경 개선

    By adding the type of second amine to enhance the polishing rate and maintain pH, we improved the problems associated with the volatilization of additive (amine type) stinks, and the pH stocking problems in which pH is rapidly reduced.
    In the case of other company, the type of first amine may cause environmental (odor) problems because the boiling point is 27 degrees at room temperature and the pH stocking problems may be caused by using Slurry.

    Improvement of particle distribution

    The dispersion of the silica particle is narrower and spherical compared to other companies.

    Improvement of Metal Impurity

    The metal impurity in Slurry is lowest.
    By adding the chelating agent into the slurry, it controls Cu and Ni ions.

Appendix - Physical properties

ITEM Unit JMS-100BH J..社 Remark
Abrasive Colloidal silica Colloidal silica
Solid content % 12.0±2.0 12.0±2.0
SpeᆞGra - 1.09 1.070
Size nm 90-110nm 80-120nm Good particle distribution
Viscosity(at 25℃) cps <3 <3
pH - 11.31 11.45
pH controller NH22+ NH4+ No smell
  • JMS-100BH 90-110nm

  • J..社 80-120nm